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VAPOR PHASE TREATMENT OF DELECTRIC MATERALS

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VAPOR PHASE TREATMENT OF DELECTRIC MATERALS ( vapor-phase-treatment-delectric-materals )

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“CleaningandRestoringkValueofPorousMSQFilms.”Clark, PhilipG.etal.,SemiconductorInternational.(2003),26(9), 46-48.50,52. "SupercriticalCarbonDioxide-basedFluidsUsedasaRecoveryTool for Low-k Materials.” Orozco-Teran, Rosa A., et al., Materials ResearchSocietySymp.Proc.vol.766.2003.p.297-302. “EfectsOfSupercriticalProcessingOnUltraLow-KFilms.”Reidy, R.F.,etal.,AdvancedMetallizationConference,ed.B.M.Melnick, T.S.Cale,S.Zaima,T.Ohta,2002.p.602-606. “Eliminatingdielectricdegradationoflow-korganosilicateglasby trimethylchlorosilanetreatment.”Chang,T.C.,etal.,Journalof VacuumScience&Technology,B:MicroelectronicsandNanometer Structures(2002),204),pp.1561-1566. “Efectiverepairtoultra-low-kdielectricmaterial(k.aprx.2.0)by hexamethyldisilazanetreatment.”Mor,Y.S.,etal.,Journalof VacuumScience&Technology,B:MicroelectronicsandNanometer Structures(2002),20(4),p.1334-1338. “RecoveringDielectricLossofLow DielectricConstantOrganic SiloxaneduringthePhotoresistRemovalProces.”Chang,T.C.,et al.,JournaloftheElectrochemicalSociety(2002),149(8),p.F81 F84. Zielinski,E.M.,etal.,“DamasceneIntegrationofCopperandUltra Low-kXerogelforHighPerformanceInterconects',IEEEIEDM Tech.Digest,Dec.1997,p.936-938(197). P.Liu,etal.,“EnhancingtheOxygenPlasmaResistanceofLow-k MethylsilsesquioxanebyH.PlasmaTreatment.”JapaneseJournalof AppliedPhysics,vol.38,p.3482-3486(1999). Q.Han,etal.,“EnablingLow-kMaterialIntegrationThroughLow ionPlasmaDryStripProceses.”MicroMagazine,p.51-63(Oct. 19). *citedbyexaminer US7,678,712B2 Page3

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