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(see Fig. 5). High-resolution Auger microscopy shows that flat areas contain Cu and no Cd, whereas triangular pit regions are free of Cu and contain Cd. Fig. 5: Secondary electron micrograph and corresponding Auger map of a CdTe(111)-B surface after experiments involving deposition of Cu and heating to 250°–300°C. Through UPS measurements, we observed that Cu changes the near-surface, valence-band (VB) structure. For clean CdTe, the VB is about 0.5 eV below the Fermi level, whereas CdTe with surface-segregated Cu has electronics states just below the Fermi level. An experiment to test the significance of this observation was designed and carried out. Au contacts were deposited in situ on a clean CdTe surface with and without the surface-segregated Cu phase. The Au/CdTe contact exhibited rectifying Schottky-type behavior, whereas the Au/Cu/CdTe contact was ohmic. Ongoing work will seek to discriminate between doping by diffused Cu and the surface- segregated phase. We studied the chemical changes at the CdTe surface that result from steps used by a particular manufacturer in its process. This work mimicked a wet chemical step used to treat the back surface of CdTe devices. Samples were treated in a N2- purged glove box and then transferred directly to vacuum, via the cluster tool, for analysis. We have shown that this part of the process removes oxide and carbonaceous contaminants from the CdTe surface and also preferentially removes Cd, leaving a thin, beneficial Te layer. This work was extremely significant for the manufacturer. 3.5 Process Integration Task Complete preliminary design specifications of the process integration platform to facilitate seamless integration of deposition, processing, and characterization tools (MYTP M-5, T-1): A contract was awarded to Transfer Engineering to develop detailed engineering drawings for the prototype process-integration tool that is based on a detailed set of design specifications (25-page statement of work) developed by the NCPV design team. Issuing the contract to complete engineering services marks a significant milestone in the process-integration project. The contract includes the following scope: • Full-design engineering of a prototype tool, such that the final design package can be sent out for bid to a tool fabrication company • Engineering design to incorporate the following elements into the prototype tool: o Sample platen designs that can accommodate several substrate configurations o A transport pod to provide a means of moving sample platens between future tools o A dock to provide an interface between the transport pod and the tool chamber and house the sample transfer mechanisms o A thermal test chamber to test out heater designs for heating uniformity, and other tests, and expansion for PVD applications. o A transfer mechanism to reliably move the platen between various system components. NREL will own these designs, allowing us to incorporate the design into future tools. Many groups within the NCPV are currently using these ideas and incorporating them into their next generation tools so they will be prepared to make the best possible purchases as capital equipment funds become available. Once the design is finalized, a separate RFQ will be prepared for the fabrication of the prototype tool.PDF Image | FY 2004 ANNUAL REPORT DOE Solar
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